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Implantable devices are a unique area for circuit designers. A comprehensive understanding of design trade-offs at the system level is important to ensure device success. This book provides knowledge to CMOS circuit designers with limited biomedical background to understand design challenges and trade-offs for implantable devices, especially neural interfacing.

Provides an overview of results of the DOTSEVEN EU research project, and as such focusses on key material developments for mm-Wave Device Technology. This volume provides a detailed description of the obtained research results in process development, device simulation, compact device modeling, experimental characterization, reliability, (sub-)mm-wave circuit design and systems.

Rad-hard Semiconductor Memories is intended for researchers and professionals interested in understanding how to design and make a preliminary evaluation of rad-hard semiconductor memories, making leverage on standard CMOS manufacturing processes available from different silicon foundries and using different technology nodes.In the first part of the book, a preliminary overview of the effects of radiation in space, with a specific focus on memories, will be conducted to enable the reader to understand why specific design solutions are adopted to mitigate hard and soft errors. The second part will be devoted to RHBD (Radiation Hardening by Design) techniques for semiconductor components with a specific focus on memories. The approach will follow a top-down scheme starting from RHBD at architectural level (how to build a rad-hard floor-plan), at circuit level (how to mitigate radiation effects by handling transistors in the proper way) and at layout level (how to shape a layout to mitigate radiation effects).After the description of the mitigation techniques, the book enters in the core of the topic covering SRAMs (synchronous, asynchronous, single port and dual port) and PROMs (based on AntiFuse OTP technologies), describing how to design a rad-hard flash memory and fostering RHBD toward emerging memories like ReRAM. The last part will be a leap into emerging memories at a very early stage, not yet ready for industrial use in silicon but candidates to become an option for the next wave of rad-hard components. Technical topics discussed in the book include: i Radiation effects on semiconductor components (TID, SEE)i Radiation Hardening by Design (RHBD) Techniquesi Rad-hard SRAMsi Rad-hard PROMsi Rad-hard Flash NVMsi Rad-hard ReRAMsi Rad-hard emerging technologies

Sensors and measurement systems is an introduction to microsensors for engineering students in the final undergraduate or early graduate level, technicians who wants to know more about the systems they are using, and anybody curious enough to know what microsystems and microsensors can do. The book discusses five families of sensors: - Thermal sensors - Force and pressure sensors- Inertial sensors - Magnetic field sensors- Flow sensorsFor each sensor, theoretical, technology and application aspects are examined. The sensor function is modelled to understand sensitivity, resolution and noise. We ask ourselves: What do we want to measure? What are possible applications? How are the sensor chips made in the cleanroom? How are they mounted and integrated in a system?After reading this book, you should be able to:- Understand important thermal, mechanical, inertial and magnetic sensors- Work with characterization parameters for sensors- Choose sensors for a given application and apply them- Understand micromachining technologies for sensors

The increasing demand for more content, services, and security drives the development of high-speed wireless technologies, optical communication, automotive radar, imaging and sensing systems and many other mm-wave and THz applications. S-parameter measurement at mm-wave and sub-mm wave frequencies plays a crucial role in the modern IC design debug. Most importantly, however, is the step of device characterization for development and optimization of device model parameters for new technologies. Accurate characterization of the intrinsic device in its entire operation frequency range becomes extremely important and this task is very challenging.This book presents solutions for accurate mm-wave characterization of advanced semiconductor devices. It guides through the process of development, implementation and verification of the in-situ calibration methods optimized for high-performance silicon technologies.Technical topics discussed in the book include:i Specifics of S-parameter measurements of planar structuresi Complete mathematical solution for lumped-standard based calibration methods, including the transfer Thru-Match-Reflect (TMR) algorithmsi Design guideline and examples for the on-wafer calibration standards realized in both advanced SiGe BiCMOS and RF CMOS processesi Methods for verification of electrical characteristics of calibration standards and accuracy of the in-situ calibration resultsi Comparison of the new technique vs. conventional approaches: the probe-tip calibration and the pad parasitic de-embedding for various device types, geometries and model parametersi New aspects of the on-wafer RF measurements at mmWave frequency range and calibration assurance.

This book on electronic skin takes into account not only sensing materials, but it also provides a thorough assessment of the current state of the art at system level. The book addresses embedded electronics and tactile data processing and decoding, techniques for low power embedded computing, and the communication interface.

This book explores the fundamentals, recent advances, and applications of the physics of highly correlated materials. This book serves as a handbook/reference for advanced graduate students.

The book describes important networking standards, classifying their underlying technologies in a logical manner and gives detailed examples of successful applications. The book provides examples with supporting MATLAB codes and hands-on projects.