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  • Spar 10%
    av K. L. Mittal
    2 198,-

    Keep up-to-date with the latest on adhesion and adhesives from an expert group of worldwide authors. The book series Progress in Adhesion and Adhesives was conceived as an annual publication and the premier volume made its debut in 2015. The series has been well-received as it is unique in providing substantive and curated review chapters on subjects that touch many disciplines. Peer-reviewed and edited by Dr. Mittal, the individual chapter reviews have become a trusted source of quality information. The current book contains eight commissioned chapters and cover topics including stress distribution and design analysis of adhesively bonded tubular composite joints; durability of structural adhesive joints; mechanical surface treatment of adherends for adhesive bonding; surface modification of polymer materials by excimer UV light; corona discharge treatment of materials to enhance adhesion; adhesion activation of aramid fibers; dual-cured hydrogels for bioadhesives and biomedical applications; and non-adhesive SLIPS-like surfaces. Audience This book will be valuable and useful to adhesionists and adhesive technologists, polymer scientists, materials scientists as well as those involved/interested in adhesive bonding, packaging, printing, modification of polymer surfaces, biomedical applications, and non-adhesive and omniphobic surfaces.

  • av K. L. Mittal
    2 268,-

    Structural AdhesivesUniquely provides up-to-date and comprehensive information on the topic in an easily-accessible form.A structural adhesive can be described as a high-strength adhesive material that is isotropic in nature and bonds two or more parts together in a load-bearing structure. A structural adhesive material must be capable of transmitting the stress/load without loss of structural integrity within design limits. There are many types of established structural adhesives, including epoxy, urethane, acrylic, silicone, etc.Structural Adhesives comprises nine chapters and is divided into two parts: Part 1, Preparation, Properties, and Characterization; Part 2, Applications.The topics covered include: structural epoxy adhesives; biological reinforcement of epoxies as structural adhesives; marble dust reinforced epoxy structural adhesive composites; characterization of various structural adhesive materials; effects of shear and peel stress distributions on the behavior of structural adhesives; the inelastic response of structural aerospace adhesives; structural reactive acrylic adhesives: their preparation, characterization, properties, and applications; application of structural adhesives in composite connections; and naval applications of structural adhesives.AudienceThis book should be of much use and interest to adhesionists, materials scientists, adhesive technologists, polymer scientists, and those working in the construction, railway, automotive, aviation, bridge, and shipbuilding industries.

  • av K. L. Mittal
    2 621,-

    Biobased AdhesivesUnique and comprehensive book edited by acknowledged leaders on biobased adhesives that will replace petroleum-based adhesives.This book contains 23 chapters covering the various ramifications of biobased adhesives. The chapters are written by world-class scientists and technologists actively involved in the arena of biobased adhesives. The book is divided into three parts: Part 1: Fundamental Aspects; Part 2: Classes of Biobased Adhesives; and Part 3: Applications of Biobased Adhesives. Topics covered include: an introduction to biobased adhesives; adhesion theories and adhesion and surface issues with biobased adhesives; chemistry of adhesives; biorefinery products as biobased raw materials for adhesives; naturally aldehyde-based thermosetting resins; natural crosslinkers; curing and adhesive bond strength development in biobased adhesives; mimicking nature; bio-inspired adhesives; protein adhesives; carbohydrates as adhesives; natural polymer-based adhesives; epoxy adhesives from natural materials; biobased polyurethane adhesives; nanocellulose-modified adhesives; debondable, recyclable, and biodegradable biobased adhesives; 5-Hydroxymethylfurfural-based adhesives; adhesive precursors from tree-derived naval stores; and applications in various diverse arenas such as wood bonding, controlled drug delivery, and wearable bioelectronics.AudienceThis book will interest materials scientists, adhesionists, polymer chemists, marine biologists, food and agriculture scientists, and environmentalists. R&D personnel in a slew of wide-ranging industries such as aviation, shipbuilding, railway, automotive, packaging, construction, wood bonding, and composites should find this book a repository of current and much-needed information.

  • av K. L. Mittal
    1 131,-

    This volume chronicles the proceedings of the Third Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectric Science and Technology Division of the Electrochemical Society in Phoenix, Arizona, October 13-18, 1991. This series of symposia to address the subject of metallized plastics was initiated in 1988 and the premier symposium was held in Chicago, October 10-12, 1988, followed by the second event in Montreal, Canada, May 7-10, 1990. The rroceedings of these two symposia have been properly documented ,2. The third symposium was a huge success like the previous two events, and all this is testimonial to the brisk interest and high tempo of R&D activity in the fie14 of metallized plastics. This further bolsters our earlier thinking that there was a conspicuous need to hold symposia on this topic on a regular basis and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. The study of metallized plastics constitutes an important human endeavor l and as pointed out earlier there are myriad applications of metallized plastics ranging from very commonplace to exotic. Also a survey of the recent literature will reveal that both the fundamental and applied aspects of metallized plastics are being pursued with great vigor.

  • - Applications in Adhesion and Related Areas
    av K. L. Mittal & Wei-Sheng Lei
    2 577,-

    The acronym Laser is derived from Light Amplification by Stimulated Emission of Radiation. With the advent of the ruby laser in 1960, there has been tremendous research activity in developing novel, more versatile and more efficient laser sources or devices, as lasers applications are ubiquitous. Today, lasers are used in many areas of human endeavor and are routinely employed in a host of diverse fields: various branches of engineering, microelectronics, biomedical, medicine, dentistry, surgery, surface modification, to name just a few. In this book (containing 10 chapters) we have focused on application of lasers in adhesion and related areas. The topics covered include: Topographical modification of polymers and metals by laser ablation to create superhydrophobic surfaces. Non-ablative laser surface modification. Laser surface modification to enhance adhesion. Laser surface engineering of materials to modulate their wetting behavior. Laser surface modification in dentistry. Laser polymer welding. Laser based adhesion testing technique to measure thin film-substrate interface toughness. Laser surface removal of hard thin ceramic coatings. Laser removal of particles from surfaces. Laser induced thin film debonding for micro-device fabrication applications.

  • av K. L. Mittal
    2 412,-

    The book provides a unique overview on laser techniques and applications for the purpose of improving adhesion by altering surface chemistry and topography/morphology of the substrate.

  • Spar 11%
    av K. L. Mittal
    2 225,-

    This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source.

  • Spar 11%
    av K. L. Mittal
    2 225,-

    The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments.

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