Bøker i Springer Series in Advanced Microelectronics-serien

This book investigates several non-resonant inductive harvester architectures in order to find the magnet coil arrangement that generates the largest power output. The book is useful as a step-by-step guide for readers unfamiliar with this form of energy harvesting, but who want to build their own system models to calculate the magnet motion and, from that, the power generation available for body-worn sensor systems. The detailed description of system model development will greatly facilitate experimental work with the aim of fabricating the design with the highest predicted power output. Based on the simulated optimal geometry, fabricated devices achieve an average power output of up to 43 mW during walking, an amount of power that can supply modern low-power, body-worn systems. Experiments were also carried out in industrial applications with power outputs up to 15 mW. In sum, researchers and engineers will find a step-by-step introduction to inductive harvesting and its modeling aspects for achieving optimal harvester designs in an efficient manner.  

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

This book investigates several non-resonant inductive harvester architectures in order to find the magnet coil arrangement that generates the largest power output.

This book describes the optimized implementations of several arithmetic datapath, controlpath and pseudorandom sequence generator circuits for realization of high performance arithmetic circuits targeted towards a specific family of the high-end Field Programmable Gate Arrays (FPGAs).

This book is dedicated to field emission electronics, a promising field at the interface between "classic" vacuum electronics and nanotechnology. It particularly focuses on research into and production of field cathodes and electron guns using recently developed nanomaterials and carbon nanotubes.

This book provides the analytical theory of complex systems composed of a large number of high-Q dielectric resonators. The scattering process of short pulses in dielectric filter structures, dielectric antennas and lattices of dielectric resonators is discussed.

This book describes the newest implementations ofintegrated photodiodes fabricated in nanometer standard CMOS technologies. This book showsthe newest results for the performance of integrated optical receivers, laserdrivers, modulator drivers and optical sensors in nanometer standard CMOStechnologies.

This book presents recent results in the development of analog filters in nanometer CMOS. It describes methods for successfully dealing with nanometer devices and includes numerous detailed circuit diagrams and plots of measured results.

This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.

This first book on load-pull systems is intended for readers with a broad knowledge of high frequency transistor device characterization, nonlinear and linear microwave measurements, RF power amplifiers and transmitters.

This book describes the physical basis of microwave electronics and related topics, such as microwave vacuum and microwave semiconductor devices.It comprehensively discusses the main types of microwave vacuum and microwave semiconductor devices, their principles of action, theory, parameters and characteristics, as well as ways of increasing the frequency limit of various devices up to the terahertz frequency band. Further, it applies a unified approach to describe charged particle interaction within electromagnetic fields and the motion laws of charged particles in various media.  The book is intended as a manual for researchers and engineers, as well as advanced undergraduate and graduate students.

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

This book introduces simulation tools and strategies for complex systems of solid-state-drives (SSDs) which consist of a flash multi-core microcontroller plus NAND flash memories.

With contribution by numerous experts

In order to cover the topic comprehensively, Silicon Optoelectronic Integrated Circuits presents detailed descriptions of many OEICs for a wide variety of applications from various optical sensors, smart sensors, 3D-cameras, and optical storage systems (DVD) to fiber receivers in deep-sub-m CMOS.

This is the first book on lock-in thermography, an analytical method applied to the diagnosis of microelectronic devices. This useful introduction and guide reviews various experimental approaches to lock-in thermography, with special emphasis on the lock-in IR thermography developed by the authors themselves.

This book features a unique combination of mathematical treatment of random process variation, electrical noise and temperature, and circuit realizations for on-chip monitoring and performance calibration. Includes examples and easy to follow procedures.

Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS.

This book describes the physical basis of microwave electronics and related topics, such as microwave vacuum and microwave semiconductor devices.It comprehensively discusses the main types of microwave vacuum and microwave semiconductor devices, their principles of action, theory, parameters and characteristics, as well as ways of increasing the frequency limit of various devices up to the terahertz frequency band. Further, it applies a unified approach to describe charged particle interaction within electromagnetic fields and the motion laws of charged particles in various media.  The book is intended as a manual for researchers and engineers, as well as advanced undergraduate and graduate students.

Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS.