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  5. 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

av Tzyy-Sheng Jason Horng, Lih-Tyng Hwang

del av Wiley - IEEE-serien

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility av Tzyy-Sheng Jason Horng
Om 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments * Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility * Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab * Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail * Provides chapter-wise review questions and powerpoint slides as teaching tools

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  • Språk:
  • Engelsk
  • ISBN:
  • 9781119289647
  • Bindende:
  • Hardback
  • Sider:
  • 464
  • Utgitt:
  • 19 juni 2018
  • Dimensjoner:
  • 168x239x28 mm.
  • Vekt:
  • 839 g.
  Gratis frakt
Leveringstid: 2-4 uker
Forventet levering: 25 juli 2024

Om Tzyy-Sheng Jason Horng

Se alle bøkene av Tzyy-Sheng Jason Horng

Beskrivelse av 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
* Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
* Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab
* Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
* Provides chapter-wise review questions and powerpoint slides as teaching tools

Brukervurderinger av 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility



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