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MEMS Packaging Technologies and 3D Integration

Om MEMS Packaging Technologies and 3D Integration

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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  • Språk:
  • Engelsk
  • ISBN:
  • 9783036542584
  • Bindende:
  • Hardback
  • Sider:
  • 210
  • Utgitt:
  • 1. juni 2022
  • Dimensjoner:
  • 175x18x250 mm.
  • Vekt:
  • 727 g.
  Gratis frakt
Leveringstid: 2-4 uker
Forventet levering: 2. september 2025

Beskrivelse av MEMS Packaging Technologies and 3D Integration

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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